→ Amd ryzen 9 3900x review in Spanish (full analysis)?

We really wanted to bring you the review of one of the best processor ever made for multi-tasking and gaming: the AMD Ryzen 9 3900X. Manufactured in a 7nm lithography and Zen 2 architecture, compatible with the AM4 socket, a power of 12 physical and 24 logical cores, 64 MB of L3 cache and that can reach up to 4.6 GHz.

Will it live up to the i9-9900k or HEDP (High-End Desktop PCs) platform processor. All this and much more in our review! Let's start!

As always, we thank AMD for the trust placed in leaving us the sample for analysis.

AMD Ryzen 9 3900X technical features

Unboxing

At last we have our first new generation AMD processors, which have come to us with a presentation of the highest level. In this case we are going to try to completely dismantle the AMD Ryzen 9 3900X, which formed a pack of products, along with the 3700X in a black cardboard box with a large AMD logo on its external face.

And the design could not be better, because AMD has not only innovated in the architecture of its processors, and in what way, but also in the presentations. We now have thick square solid cardboard boxes with slide-up opening.

You already have the decoration of the box on display, clearly denoting that we have a Ryzen in our hands with a huge logo on gray gradient colors and red details of the house. “ Built to Perform, Designed to Win ” is what makes it one of its faces, and we trust that this will be the case as soon as we connect this CPU to the new X570 motherboards. On the other faces we also have some other information about the product and a great photograph of the fan that is part of the dissipation system that is included, and yes, it is also RGB and in the same style as the 2nd generation Ryzen.

We continue, because we have to look at the upper area and yes, we have the processor visible from the outside through a small opening in the cardboard. At the same time, it is protected in a transparent and very hard plastic encapsulation, although it was not necessary to leave it so exposed having this excellent box to protect it more.

Another element of great importance in the bundle are the instructions, I mean, the heatsink of this AMD Ryzen 9 3900X, which is certainly as good as that of the previous generation. A large block consisting of aluminum finned and copper base and heatpipes with built-in fan. And it is that it will be what occupies more space in the box, and the fundamental reason for its existence. Besides this, we have absolutely nothing else, so let's proceed to see its exterior design and interesting facts.

Exterior and encapsulated design

The AMD Ryzen 9 3900X is part of the third generation of AMD Ryzen family processors, for friends, Zen2. CPUs that have given the manufacturer a lot of joy due to the enormous leap in quality and power compared to the previous Bulldozer and Excavator. And AMD has dramatically evolved its desktop CPUs to become one step ahead of Intel when it comes to manufacturing and power. Zen2 is based on 7nm FinFET cores and a new Infinity Fabric bus that greatly improves the speed in operations between processor and memory.

As you can understand this will not take us too long, since AMD Ryzen 9 3900X has a design just like the rest of the CPU. This means that we are facing a processor that is mounted on an AM4 socket, like its previous generation and, consequently, with the gold-plated pins mounted on the substrate of great thickness and quality, as expected.

The work AMD has done with this new generation of CPU is very interesting. Despite having increased so much performance, having deeply modified the architecture and having introduced more cores and memory, everything will continue to work perfectly in a socket that is already a few years old. This opens up great possibilities for compatibility with both old boards and old processors on new boards, something that Intel does not even consider, "best for business" clearly.

In the central area we see a completely clean substrate without protection capacitors, as they are implemented directly in the socket, and the typical arrow that indicates the way of alignment with our motherboard. Something important to position the CPU well, since the Ryzen with have perforations or grimaces on their side edges.

And if we turn it around, we see that the panorama has not changed much either, since we have a large encapsulation or IHS built in copper with silver plating in which STIM has been used, or what is the same, AMD has soldered this IHS to the DIE of the processor. It is something that we could expect in a CPU as extremely powerful as this, since a solder allows heat to be transferred much more efficiently to the outer surface of the heatsink. A 12-core CPU like this is going to generate quite a bit of heat, so STIM is the most efficient way to build it.

This has an advantage and a disadvantage. The advantage, clearly higher thermal efficiency in the die containing the chiplet for use by 99% of users. The disadvantage, that users who want to make a delid will have it much more complicated, although of course, very few users do this, and AMD is cured in health.

Heatsink design

The second element of the bundle is this excellent AMD Wrait Prism heatsink which is practically the same as that included in processors such as the Ryzen 2700X and others similar. In fact, we have exactly the same dimensions, design, and fan. These details are what AMD likes, who cares about the products it sells, and provides the user with a worthwhile dissipation system.

Well, starting with the upper area, you see, we have a 92 mm diameter fan that implements a halo of RGB LED lighting throughout the outer ring and also in the axis of rotation of the same, giving us a purely gaming aspect already of fabric. Such lighting is compatible with the main lighting technologies of motherboard manufacturers.

And if we continue downwards, we have a block divided into two floors, both built in aluminum and forming part of the same element with a high density of vertical finning that will be bathed by the pressurized air from the fan. Its base is entirely made of copper, where four heatpipes make direct contact with the AMD Ryzen 9 3900X IHS through a thin sheet of pre-applied thermal pass. On both sides of the heatpipes the contact block continues with two copper plates that increase the heat transfer surface towards the finned block.

Benefits

We are going to see its architecture in detail, but before, it is convenient that we know a little better what this AMD Ryzen 9 3900X has inside, we are talking about memory cores, etc. And it is that we are facing a configuration of 12 cores and 24 processing threads, evidently using AMD SMT multicore technology in all its Ryzen processors and the unlocked multiplier to be able to overclock.

These physical cores are built by TSMC in 7nm FinFET lithography and are capable of reaching a frequency of 3.8 GHz in base mode and 4.6 GHz in boost mode. In fact, we have an improved AMD Precision Boost 2 technology that will raise the core frequency only when needed, requesting information about the load every 1 ms. Now the structure on which these new CPUs are based is called a chiplet, which are basically 8-core modules with memory in which the manufacturer deactivates or activates the operating cores of each model.

And speaking of cache memory, it has been increased by no less than double the capacity for each four cores, being 12 MB. This makes a total of 64MB of L3 cache on the AMD Ryzen 9 3900X along with 6MB of L2 cache, 512KB per core. And we cannot forget that the native support for the PCI-Express 4.0 bus has been implemented, teaming up with the new AMD X570 chipset we will have faster graphics cards in the near future, and much faster NVMe SSDs, and these are indeed a fact.

For the rest, the processor TDP remains at only 105W despite having 12 cores, it is one of the advantages of 7 nm, less consumption and more power. Ryzen has not been released to the market in APU configuration, that is, we do not have integrated graphics in this model, and we will need a dedicated graphics card. The memory controller that is kept at 12nm now supports 128GB DDR4 at 3200MHz in dual channel configuration.

Extending a little more in its architecture

Taking advantage of the fact that it is one of the most powerful models, and only below the Ryzen 9 3950X, we will explain in more detail the architecture of this new 3rd generation Ryzen family of processors, also called Zen2. Because AMD has not only reduced the size of the transistors that make up the processor, but has also improved in almost all aspects all the handling of instructions and operations.

Obviously the first improvement that characterizes this new generation is the reduction of the lithography of the transistors, now in the manufacturing process of only 7 nm FinFET by the hand of TSMC. This generates more free space in the substrate of the processor, being able to introduce a greater number of cores and cache modules. And this is how we arrived at the next improvement, and that is that now to refer to a CPU we must introduce the concept of chiplet (not to be confused with chipset).

Chiplets are the processing modules that are implemented in the CPU. It is not a matter of building a chip with a certain number of cores, varying according to the model, but of manufacturing modules with a fixed number of cores and deactivating those that are appropriate to give more or less power depending on which model. Each of these chiplets that we will call CCD (Core Chiplet DIE) has a total of 8 cores and 16 threads, divided into blocks of 4 physical and 8 logical, since in all cases AMD SMT multicore technology is used .

Well, we know that these chiplets are 7nm, but there are still elements built at 12nm, such as the PCH (Platform Controller Hub). Although this memory controller has been completely redesigned under the name of Infinity Fabric, capable of working at 5100 MHz. Precisely this was one of the pending subjects of AMD in the previous Ryzen, and the reason for having lower performances than the possibilities of the CPUs, especially in the EPYC series. For this reason, DDR4-3200 MHz speeds and a capacity of up to 128 GB are supported.

If we go deeper into how the CPU itself works, we will also find important news. Zen2 is an architecture that tries to improve the IPC (instructions per cycle) of each core by up to 15% compared to the previous generation. The capacity of the micro operations cache has been doubled, now being 4KB, and a new TAGE (Tagged Geometry) predictor has been installed to improve the previous search for instructions. Similarly, the cache has undergone modifications, becoming 32KB in both L1D and L1I but increasing its association level to 8 channels, that is, one per physical core.

The L2 cache is kept at 512 KB per core, with BTB (Branch Target Buffer) function and now with greater capacity (1KB) in the indirect destination array. As for the L3 cache, you have already seen that it has doubled in capacity with up to 16 MB for each 4 cores, or what is the same, 32 MB for each CCD with a latency reduced to 33 n s, which now He calls it Gamecache. All this has facilitated the improvement in bandwidth for loading and storing instructions, 2 loads and 1 saved with capacity for 180 records where a third AGU (Address Generation Unit) has been added to facilitate the exchange of information in Cores and Threads for SMT.

As for the ALU and FPU, the performance in integer calculations has also been significantly improved, as the load bandwidth is now 256 bits instead of 128 bits supporting AVX-256 instructions. This will contribute to better performance under very heavy loads such as rendering or mega-tasking. And AMD hasn't forgotten about the hardware security layer now immune to Specter V4 attacks.

AMD X570 CPU and chipset I / O interface

A separate mention deserves this AMD X570 chipset and the I / O configuration that have both elements together.

In case you do not know it yet, AMD X570 is the new chipset that the manufacturer has created for its new generation of processors, such as the AMD Ryzen 9 3900X that we analyze today. One of the great novelties of the X570 is that it is compatible with PCIe 4.0 as well as the CPU, a powerful set of chips that do the function of south bridge with nad less than 20 LANES available for the flow of information with peripherals, USB ports and also high-speed PCI lines for solid-state storage.

We recommend our comparison AMD X570 vs X470 vs X370: differences between the chipsets for Ryzen 3000

As we see in the photo, X570 has support for the following elements:

• 8 fixed and exclusive lanes for PCIe 4.08 lanes for SATA 6Gbps or USB 3.1 Gen24 lanes Free use Pick One lanes according to manufacturer's choice

And as far as the CPU is concerned, we have the following I / O capacity:

• Maximum AM4 socket capacity + 36/44 LANES PCIe 4.0 chipset depending on CPU model. AMD Ryzen 9 3900X has 24 LANES available So 24 LANES PCIe 4.0: x16 for dedicated graphics, x4 for NVMe and x4 for direct communication with the chipset4x USB 3.1 Gen2Pick One up to 4 lanes for NVMe or SATA Dual Channel DDR4 RAM memory controller- 3200 MHz

Test bench and performance tests

TESTING BENCH
Processor:	AMD Ryzen 9 3900X
Base plate:	Asus Crosshair VIII Hero
RAM:	16GB G.Skill Trident Z RGB Royal DDR4 3600MHz
Heatsink	Stock
HDD	Corsair MP500 + NVME PCI Express 4.0
Graphic card	Nvidia RTX 2060 Founders Edition
Power supply	Corsair AX860i.

To check the stability of AMD Ryzen 9 3900X processor in stock values. The motherboard we have stressed with Prime 95 Custom and air cooling. The graph that we have used is an Nvidia RTX 2060 in its reference version, without further delay, let's see the results obtained in our tests.

Benchmarks (Synthetic tests)

We have tested performance with the enthusiastic platform and the previous generation. Will your purchase be worth it?

• Cinebench R15 (CPU Score).Cinebench R20 (CPU Score).Aida64.3dMARK Fire Strike.VRMARKPCMark 8Blender Robot.

Game testing

The overclocking issue has its pros and cons. The biggest problem is that we have not managed to raise even one MHz to the processor, that is, to raise more than the values ​​that the serial brings the whole team crashes you. Both with the AMD Ryzen Master application and from the BIOS with the ASUS, Aorus and MSI motherboards that we have tested.

Is there something good? Yes, the processors already come to the limit of series and we do not have to do anything at all to make them work to the maximum. The full frequency is placed between 4500 and 4600 MHz, taking into account its 12 cores it seems like a blast. And the AMD Ryzen 9 3950X is yet to come.

We can affirm that a good motherboard has a very important part in this new series of processors. The higher the quality of your VRMs, the better they can generate a cleaner signal, thus allowing the processor to offer the best performance. We are confident that Intel will continue its tenth generation overclocking philosophy and AMD will have a hard time with competing 5 GHz processors.

NVMe PCI Express 4.0 performance

One of the incentives of this new AMD X570 motherboards is the compatibility with NVME PCI Express 4.0 x4 SSD, leaving aside the PCI Express 3.0 x4. These new SSDs have a capacity of 1 or 2 TB, a reading of 5000 MB / s and a sequential writing of 4400 MB / s. Spectacular!

These rates could only be achieved with a RAID 0 of NVME PCIE Express x3.0. We have used a Corsair MP600 (the review will be on the web soon) to test the performance of our system. The results speak for themselves.

Consumption and temperature

Keep in mind that it is at all times with the stock sink. The idle temperatures are somewhat high, 41 ºC but it must be taken into account that they are twelve logical processors plus the SMT that the 24 threads do. The temperatures in full are very good, with 58 ºC on average with Prime95 in Large mode for 12 hours.

We have to point out that the consumption is measured from the power cable of our PC on the wall with prime95 for 12 hours. We have a consumption of 76 W at rest and 319 W at maximum performance. We believe that they are outstanding measures and that they make having a very powerful equipment, with good temperatures and very good consumption. Good job AMD!

Final words and conclusion about AMD Ryzen 9 3900X

The AMD Ryzen 9 3900X has left us with a great taste in our test bench. A processor with 12 physical cores, 24 threads, 64 MB of L3 cache, a base frequency of 3.8 GHz and turbo up to 4.6 GHz, a TDP of 105W and a TjMAX of 95 ºC.

In benchmarks it has had a nice fight with the i9-9900k and i9-9980XE, where we see a clear winner in most tests: AMD Ryzen 9 3900X. In Gaming we have been surprised that it performs better than the AMD Ryzen 7 3700X, and this is because the turbo frequency is higher than that of the Ryzen 9: 4.6 GHz vs 4.4 GHz.

We did not like that the overclock is automatic, it has its positive point, but the old school we like to try to maximize the processor. But the reality is that the automatic option works very well, nothing to do with the previous two generations of AMD with XFR2.

We recommend reading the best processors on the market

In terms of temperatures and consumption they are very good. Already with the first generation of Ryzen we saw a great leap, with this new series we cannot complain. What we would have liked is that the heatsink included in the series was better, because it shows that it goes to the limit of its possibilities and makes a lot of noise (it is always revolutionized). We believe that buying a good liquid cooler would go a long way to win quietly and always keep the processor at bay.

It is expected that the price in the online store will fluctuate around 500 euros (we do not have an official price at the moment). We think it is a great alternative and much more palatable than the i9-9900k. Both for its cores, frequencies, consumption, temperatures and everything that its new X570 motherboards offer. We believe that it is the best option that we can currently buy for the enthusiastic user. Happy messing around!

ADVANTAGE	DISADVANTAGES
- ZEN 2 AND 7NM LITHOGRAPHY	- STOCK HEAT SINK GOES VERY FAIR. IT MAKES A LOT OF NOISE
- PERFORMANCE AND CORES	- DOES NOT ALLOW MANUAL OVERCLOCK
- CONSUMPTION AND TEMPERATURES
- IDEAL FOR MULTITAREA
- QUALITY / PRICE PROCESSOR

The Professional Review team awards him the platinum medal:

AMD Ryzen 9 3900X

YIELD YIELD - 95%

MULTI-THREAD PERFORMANCE - 100%

OVERCLOCK - 80%

TEMPERATURES - 90%

CONSUMPTION - 95%

PRICE - 95%

93%

Possibly the best consumer 12-core processor on the market. Perfect for playing, streaming, using the equipment for various multitasking, with temperatures and very measured consumption.