Amd ryzen uses a high quality thermal compound, you shouldn't delid

The delid is a complex operation that involves removing the integrated heat sink (IHS) from a processor to improve its operating temperatures. It is a process that has become very popular since the arrival of Intel Ivy Bridge processors because Intel has been using a very poor quality thermal compound to bond the IHS to the die of the processor, causing its processors to get hot from excessively. Is it the same with AMD Ryzen ?

AMD Ryzen doesn't follow Intel's fad of using poor quality thermal compound

Thanks to the delid it has been seen how Intel's processors reduce their operating temperature by up to 20ºC, which is why it has become an almost essential operation for the most demanding users and overclockers. However, not everything is pink, the delid is a very complex operation that runs the risk of damaging the processor and ending up with a nice paperweight.

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Many users wondered if AMD would follow Intel's fad of putting a low-quality thermal compound under the IHS. The der8auer overclocker has been able to remove the IHS from an AMD Ryzen 7 processor without damaging it, however it has succeeded in the third since the first two attempts have ended with the CPUs completely useless.

AMD Ryzen uses a high quality thermal interface to bond the IHS to the die, it is a solder so it is necessary to heat the IHS so that the material melts before proceeding to the delid. After the process of removing the Indio and applying a thermal paste of the best quality , the processor temperature has only been reduced by 2ºC, so we see that the benefit is insignificant compared to the great risk of damaging the processor.

In our opinion AMD has succeeded in uniting Ryzen's die with its IHS using a high-quality thermal interface, Sunnyvale's have given a whole lesson on how to make a processor and that inefficient dissipation does not tarnish its performance.

Source: techpowerup