Asus rx 5700 tuf gaming x3 updates its thermal design

When ASUS launched the RX 5700 TUF Gaming X3 OC graphics card model in October last year, it received some negative reviews from enthusiasts and specialized websites around the world, due to its thermal design. ASUS appears to have acknowledged these criticisms and is releasing an updated model with improvements to the cooling system.

ASUS RX 5700 TUF Gaming X3 OC relaunches with cooling system improvements

While the initial version of the ASUS RX 5700 TUF Gaming X3 OC graphics card admirably managed the core temperatures of the GPU, graphics card reviewers noted that a critical part of the card's heatsink design was missing.. Critical PCB areas, such as VRAM, had to rely solely on the airflow from the fans for cooling.

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This meant that, under heavy load, the VRAM heats up about 10 degrees more than in the reference model. There have been cases where the memory could reach 88 degrees with overclocking. Although this is still within the operating range of Micron memory modules, it is not optimal.

ASUS has accepted this constructive criticism and released a revised version of the RX 5700 TUF Gaming X3 OC and the RX 5700 XT equivalent card, which features a completely redesigned heatsink and a new Axial Tech fan solution to solve this problem. According to Asus, the revised design of the heat sink will provide better contact with critical areas of the PCB such as VRAM, for better dissipation performance.

The rest of the graphics card specifications seem to be the same and the price of the new model has not changed with respect to the original one launched in October either. We will keep you informed.

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