Amd engineer recommends how to put thermal paste on cpus
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The community has an endless debate on how to apply thermal paste on processors. Some users use lines, dots, rings, or even combinations between various methods, but which one is best for this task. An AMD engineer has responded in a reddit thread, which seems like a strong opinion to us.
The opinion of an AMD engineer
This whole story begins with a reddit post in which the following photo of a Ryzen 5 3600 was hung :
The image is retouched so that you can see where the CPU cores are and that is where a user drops the bomb.
User / johannvandelay started with the question:
A short time later, / AMD_Robert , an AMD manager who may sound familiar , answered him, since he makes different videos for the company. This is Robert Hallock , an AMD engineer in charge of technical marketing for each product they release. The person in charge noted:
The X pattern. It has been proven to be slightly better than other methods for all CPUs , not just ours
Source: Setting Sun on the Tom's Hardware forum
Subsequently, various users continued to share experiences and methodologies.
For example, some defended the point in the center, although some detractors appeared sooner rather than later .
Depending on the seconds, a point only works on processors with heatsinks with a small surface, otherwise the corners are left uncovered and the CPU suffers.
On the other hand, several users point out that another good method is to manually distribute the thermal paste.
For this, a small amount is placed on the processor and with a cardboard, card or the like, we can evenly distribute the pasta. With this methodology you have to remember to discard excess areas, since that can adversely affect refrigeration.
And you, what method have you used to distribute the thermal paste? Will you follow the advice of AMD engineer Robert Hallock ? Share your ideas below.
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