3d nand chipmakers speed transition to 96 layers

Chipmakers are accelerating the transition to 96-layer 3D NAND modules by improving their performance rates. The technology should be integrated by 2020. 96-layer 3D NAND offers lower production costs and higher storage volume per package, so manufacturers are interested in starting to mass-produce them for consumer products as soon as possible.

96 layer 3D NAND modules is the next step

It is estimated that in 2019 30% of the total production will be 96 layers, and in 2020 it should exceed the production of 64 layers. Of course, they are also working on 128-layer NAND.

The transition to 96-layer NAND 3D process technology will help suppliers reduce their manufacturing costs and improve the competitiveness of their products. Chips built using the 96-layer NAND 3D process will account for over 30% of global NAND flash production in 2019. With the acceleration of transitions to 96-layer NAND flash technology, it is expected to be 64-layer to 64-layer. 2020, according to the indicated sources.

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The NAND flash memory market has been overloaded this year. Chipmakers have been forced to slow down their capacity expansion and even production to better control their inventory levels.

Micron has revealed plans for a further 10% cut in its NAND flash production, while SK Hynix calculated that the total number of NAND wafers produced this year would be more than 10% lower than the 2018 level. Furthermore, according to Samsung Electronics is reportedly making adjustments to its production lines in the short term in response to the impact of trade disputes between Japan and South Korea.

Additionally, many NAND flash chip makers have already delivered their 120/128-layer 3D chip samples, according to sources. This will be important to see better, faster and higher capacity SSDs.

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