Mediatek goes all out with his helium x30

MediaTek is not satisfied with being present in most Asian smartphones, the Chinese designer of mobile SoCs prepares a new chip that promises to be the most powerful to become a power benchmark in mobile devices.

The MediaTek Helio X30 will be manufactured in 16nm FinFET is based on a design made up of four clusters for a total of 10 cores, its configuration is as follows:

• 4 ARM Cortex-A72 cores @ 2.5 GHz 2 ARM Cortex-A72 cores @ 2.0 GHz 2 ARM Cortex-A53 cores @ 1.5 GHz2 ARM Cortex-A53 cores @ 1.0 GHz

This type of design allows to build chips with a very large power but at the same time an excellent energy efficiency. Cortex A53 cores are very efficient and take care of the most basic tasks, when more “muscle” is needed is when Cortex A72 cores come into operation, which are much more powerful in exchange for consuming more energy. Its specifications are completed with a Mali-T880 GPU, support for DDR4L and eMMC 5.1 memory, 4G LTE, WiFi 802.11ac and support for cameras up to 40 megapixels.

On the other hand, the Chinese firm also works on the Helio X22 which is a version with higher frequencies of the Helio X20 that has not yet seen the light. We remind you of some of the characteristics of the Helio X20.

• 2 ARM Cortex-A72 cores @ 2.5 GHz 4 ARM Cortex-A53 cores @ 2.0 GHz 4 ARM Cortex-A53 cores @ 1.4 GHz

Without a doubt MediaTek is going for all in the high range with some processors that can give you more than a headache Qualcomm and its Snapdragon 810 and 820 that suffer from temperature problems.

Source: nextpowerup