Sk hynix starts producing 128-layer 4d nand chips

In the world of 3D NAND flash technology, the best way for chipmakers to increase the storage capacity of their chips is to add additional layers to their NAND structures. This is why 4D NAND technology is so important.

SK Hynix begins producing the world's first 128-layer 4D NAND chips

SK Hynix announces that it has started mass-producing the world's first 1TB 128-layer 4D NAND TLC chips using its 4D CTF (Charge Trap Flash) NAND flash technology.

Why is it considered 4D?

SK Hynix 4D technology uses a structure known as PUC flash (Periphery Under Cell). The fourth dimension is the structures that have shifted under the SK Hynix 3D NAND structure. Yes, this is not a 4D structure really…

With the company's new 1TB 128-layer chips, SK Hynix can provide increased productivity per wafer, offering a 40% gain over the company's existing 96-layer 4D NAND. Furthermore, SK Hynix has argued that this technology migration will cost 60% less than its previous technology change, which has led to surprising levels of efficiency.

Visit our guide on the best SSD drives on the market

SK Hynix plans to ship its 4D NAND chips in the second half of this year, with promising data transfer rates of 1, 400 Mbps at 1.2 V. SK Hynix also plans to internally create a 2TB SSD using this type of NAND and a controller chip. The 16TB and 32TB NVMe SSDs are also intended for the enterprise market only.

The company also intends to create 176-layer chips in the near future.

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