Via edge ai, new ai development kit based on android 8.0 bsp

VIA Edge AI is a new development kit that has been announced, which is now available to buy in two configurations in the VIA Embedded online store. We tell you all the characteristics and the different purchase options.

VIA Edge AI, new AI application development kit available in several versions

The first configuration consists of a SOM VIA SOM-9X20 module and a SOMDB2 carrier board with a 13MP CMOS camera module, with specifications that offer COB 1 / 3.06 ", and a resolution of 4224 x 3136 pixels, for $ 629 plus shipping costs.. The second setup consists of a VIA SOM-9X20 SOM module, and a SOMDB2 carrier board for $ 569 plus shipping. The 10.1 ”MIPI LCD touch panel is also available as an option for a price of $ 179 plus shipping.

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The VIA Edge AI Development Kit is optimized for intelligent real-time video capture, processing, and edge analysis. Application development is enabled by an Android 8.0 BSP, which includes support for the Snapdragon Neural Processing Engine (NPE) and full acceleration of Qualcomm Hexagon DSP to power artificial intelligence applications.

VIA has also announced that a Yocto 2.0.3-based Linux BSP will be released in June 2018, as soon as more information and full specs are released. VIA also offers a comprehensive suite of hardware and software customization services, which accelerate system commercialization and minimize development costs. Artificial intelligence is becoming more important every day, which is why all companies want to take advantage of it.

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