3D xpoint will be developed independently by intel and micron

Micron and Intel have announced an update on their partnership for the joint development of 3D XPoint memory technology, non-volatile memory with lower latency and much higher endurance than the NAND memory used in today's SSDs.

Micron and Intel will separate their ways regarding 3D Xpoint memory

Micron and Intel agreed to complete joint development for the second generation of 3D XPoint technology, something that is expected to occur in the first half of 2019. Beyond the second generation, the development of 3D XPoint technology will be pursued independently by the two companies, something that will allow it to be optimized in a better way for their respective products and business needs. Both companies will continue to manufacture 3D XPoint-based memory at the Intel-Micron Flash Technologies facility in Lehi, Utah.

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Micron has a strong track record of innovation with 40 years of world-leading experience in memory technology development, and will continue to drive the next generations of 3D XPoint technology. The new advancement in this technology will enable its customers to take advantage of unique memory and storage capabilities. For its part, Intel has developed a leadership position by delivering a broad portfolio of Optane products in the customer and data center markets. Intel Optane's direct connection to the world's most advanced computing platforms is achieving innovative results in IT and consumer applications.

3D Xpoint's long-term goal is to unify both RAM and storage in a single pool, which would provide high speed with the persistence of all data by shutting off the power, something that would avoid having to load applications every time.

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