Confirmed: xiaomi redmi pro with mediatek helio x25 and dual camera

The Xiaomi Redmi Pro is the new smartphone of the popular Chinese brand that is supposed to be announced on July 27 at an event in Beijing. New details have appeared confirming some of the specifications of the new Xiaomi terminal.

Xiaomi Redmi Pro: main technical characteristics of the new terminal

New real images confirm that the Xiaomi Redmi Pro will be manufactured with a brushed aluminum chassis and that it will also include a dual rear camera configuration, something that had already been rumored after the brand had bought a large number of sensors from Samsung. A dual rear camera setup allows for improved focus and a greater chance of applying effects to the image, of course the overall quality and sharpness are improved.

The Xiaomi CEO has also been responsible for confirming that the terminal will include an advanced MediaTek Helio X25 processor for excellent performance. The MediaTek Helio X25 maintains the same configuration as its predecessor, inside we find two Cortex A72 cores working together with eight other Cortex A53 cores much more efficient with power consumption and with a very remarkable performance. This new processor runs at a maximum frequency of 2.5 GHz and should be on par with the best chips from Qualcom and Samsung. For its part, the GPU is a Mali T880 MP4 that runs at 850 MHz for excellent performance.

Finally, the fingerprint sensor would be moved from the rear of the terminal to a supposed physical Home button.

Source: nextpowerup