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Intel details the design of its lakefield processor based on 3d fovers

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In late 2018, Intel announced the new manufacturing technology in Foveros 3D, which allows the silicon chips to be stacked on top of each other in a new way, creating a fully 3D processor.

Intel has released a video on its YouTube channel that explains the technology behind Lakefield.

At CES 2019, Intel also unveiled Lakefield, the company's first Foveros 3D processor, but now Intel has released a new video on its YouTube channel that better explains how its technology works, creating a great starting point for consumers who They want to know more about the future of Intel processors and everything behind the hood.

For starters, Intel's Lakefield CPU is Intel 's first “hybrid processor, ” offering a single 10nm Sunny Cove processing core along with four smaller 10nm CPU cores. This combination enables Intel to deliver great multithreading performance with low power consumption, while also providing its latest single-threaded IP CPU for scenarios, creating a highly versatile, low-power processor.

It is a revolutionary 'multi-layer' processor technology

Intel's Lakefield processor design is said to be 12mm by 12mm in size, an engineering feat as it includes the I / O package on its bottom layer, CPU and IP graphics in the center and DRAM on the bottom. top of the processor. Inside this small package, Intel has installed everything a PC needs, opening the doors to a new range of ultra-portable PCs.

While other companies have previously made pseudo-3D processors, commonly referred to as 2.5D, Intel is the first to build a multi-tier CPU, rather than using a silicon interposer to connect multiple chips. in a single package.

Lakefiled will be the first iteration of this technology and Intel expects them to be ready later this year, using a Sunny Cove CPU and integrated Gen11 graphics.

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