Intel lakefield, the first cpu with 3d fovers appears in 3dmark

Intel's upcoming 3D processor, codenamed Lakefield, has recently appeared in the 3DMark database. Chip detective TUM_APISAK managed to take a screenshot of the 3DMark entry.

Intel Lakefield CPU featured in 3DMark

Intel Lakefield will be the first processor to offer a 3D assembly Foveros from the chipmaker. Foveros is a technology that essentially allows Intel to stack chips on top of each other, equivalent to what storage manufacturers are doing with some new types of 3D NAND memory.

According to the 3DMark report, the unidentified processor is equipped with five cores, which matches the core configuration of Intel's Lakefield chips. As we recall, Lakefield uses a design that is similar to ARM's grand architecture. Intel complements the powerful core with other slower and more energy efficient cores.

In the Lakefield case, Intel plans to equip the processor with one Sunny Cove core and four Atom Tremont cores. The manufacturer will manufacture these new chips with a combination of nodes. Intel uses the 10nm node and the 22nm node for the base chip.

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3DMark identified the Lakefield processor with a clock speed of 2, 500 MHz, but showed the five-core part with a 3, 100 MHz core clock and a 3, 166 MHz turbo clock. As with all silicon test shipments of pre-release, this may be subject to change as development progresses.

Lakefield supports LPDDR4X memory speeds of up to 4, 266 MHz. Intel will stack the memory in a packet-over-packet (PoP) form on top of the processor. TUM_APISAK claims that the leaked processor has a physical score of 5, 200 points, which more or less puts it on the same level as a Pentium Gold G5400. We will keep you informed.

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