Intel lakefield, present the first chip made with 3d foveros
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Intel's fingernail-sized chip with Foveros technology is the first of its kind and will be used to power the next generation of Lakefield SOCs. With Foveros, processors are built in a whole new way: not with the various IPs flat-out in two dimensions, but with them stacked in three dimensions.
Intel presents Lakefield, the first chip made with 3D Foveros
Foveros raises the manufacturing of layered chips (1 millimeter thick) versus a chip with a more traditional design like a pancake. Intel's advanced Foveros packaging technology enables Intel to "mix and match" blocks of technology IP with multiple memory and I / O elements, all in a small physical package to significantly reduce board size. The first product designed in this way is "Lakefield", an Intel Core processor with hybrid technology.
Industry analyst firm The Linley Group recently named Intel's Foveros 3D stacking technology “Best Technology” at its 2019 Analysts' Choice Awards.
For its part, Lakefield represents a whole new class of chips. Offering an optimal balance of performance and efficiency with best-in-class connectivity in a small footprint - Lakefield's package area measures just 12 by 12 by 1 millimeter. Its hybrid CPU architecture combines low power “Tremont” cores with a scalable 10nm “Sunny Cove” core to intelligently deliver productivity performance when needed and power efficiency when not needed for long life. battery.
Visit our guide on the best processors on the market
Recently, three designs have been announced that work with the Intel Lakefield SOC and were designed in conjunction with the manufacturer. In October 2019, Microsoft introduced the Surface Neo, a dual-screen device. And later that month at its developer conference, Samsung announced the Galaxy Book S. Introduced at CES 2020 and expected to come out mid-year is the Lenovo ThinkPad X1 Fold, all with this revolutionary new SOC from Intel. We will keep you informed.
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