Intel lakefield, first image of this 82mm2 3d chip
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A first screenshot of the Lakefield chip has appeared, Intel's first revolutionary 3D imaging chip in semiconductor creation. The die area of the chip is 82 mm2.
Intel Lakefield, First image of this 82mm2 chip made with 3D Fovers
The screenshot is hosted by Imgur and was found by a member of the AnandTech forums. According to the image information, Lakefield's 'die' is 82mm2, as large as the 14nm dual-core Broadwell-Y chip. The green area in the center would be the Tremont cluster, which measures 5.1mm2, while the dark area below it in the bottom center would be the core of Sunny Cove. The GPU on the right, which includes the display and media engines, consumes about 40% of the die.
When Intel detailed Lakefield, Foveros, and their hybrid architecture last year, it just said the overall package size was 12mm x 12mm. This small package size is due to 3D stacking using Intel's Foveros technology: inside the package is a 22FFL base die connected to the 10nm computing die via Foveros active interposition technology. The calculation die contains a Sunny Cove core and four Atom Tremont. Above the chip, there is also a DRAM PoP (package-on-package).
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The first device announced with an Intel Lakefield chip was made during CES 2020 and was the Lenovo X1 Fold.
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