Intel does not use soldering on the xeon w

The use of a soldered thermal interface or STIM has been one of the key features of Intel's additions to its ninth-generation Core i7 and Core i9 processors. This feature has not been used since Sandy Bridge, and will allow processors to run much cooler than their predecessors. The 28-core Xeon W-3175X will not include this feature.

Xeon W-3175X 28-core well soldered to facilitate the use of extreme cooling

We now know that this STIM applies only to Core i9-9900K and Core i7-9700K processors. The 28-core Xeon W-3175X was touted by Intel as a high-end desktop processor initially, before Intel decided to retain the Xeon brand and target the gray area between HEDTs and workstations. This also means that the W-3175X will lack STIM, as confirmed by an Intel spokesperson in an interview with PC World.

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The lack of STIM usage for the Xeon W-3175X speaks to its intended use case: a workstation processor, which can be overclocked as long as the IHS is removed and cooled by exotic methods like liquid nitrogen evaporators. Intel's decisions could be guided by AMD's decision to brand its 24-core and 32-core Ryzen Threadripper processors as the "WX" brand, which focus on the competence of its workstation.

Lack of STIM will practically force users of the Xeon W-3175X to remove the IHS from the processor, since a 28-core solderless processor will get very, very hot when running at full capacity. What do you think of Intel's decision to forego the use of STIM in the powerful new 28-core Xeon W-3175X processor?

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