Intel skylake-x and kaby lake
Table of contents:
The prestigious overclocker der8auer has confirmed that the new Intel Skylake-X and Kaby Lake-X processors do not come with the IHS soldered to the die of the processor, something that is the first time seen on the Intel HEDT platform and that will impair dissipation of heat.
Intel removes solder from its HEDT processors
So Intel has decided to put toothpaste thermal paste due to the IHS of its most powerful and expensive processors, a trend that started on the mainstream platform with the arrival of the Ivy Bridges and which has led to an increase in the operating temperature of the chips because the dissipation is worse than using solder. On the other hand it has the advantage that you can remove the IHS and put the heatsink in direct contact with the die of the processor, something quite dangerous on the other hand since the die is extremely fragile.
AMD Ryzen uses a high-quality thermal compound, you shouldn't be delidious
We will have to wait to see the first analyzes but we can already expect warmer processors than previous generations.
Source: overclock3d
Intel unveils details on intel x299 hedt skylake x, kaby lake x and coffee lake s platforms
Finally all the details of the Intel X299 platform with support for the Skylake X and Kaby Lake X processors have come to light.
Intel x299 overclocking guide: for intel skylake-x and intel kaby lake processors
We bring you the first Overclock Intel X299 guide for the LGA 2066 platform. In it you can see all the steps to follow to get the most out of it.
Intel coffee lake pin configuration is different from kaby lake and skylake
Intel Coffee Lake processors bring a different pin configuration than Kaby Lake and Skylake on the LGA 1151 socket.
