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Hbm3 memory offers twice the bandwidth of the second generation

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There is no doubt that HBM memory technology is the future of graphics cards, its advantages are undeniable despite the fact that today its use continues to pose too many difficulties. HBM3 will be the third generation and we have already seen some of its impressive features.

HBM3 will offer 512 GB / s per stack

RAMBUS has revealed the specifications of the HBM3 memory that will arrive with the next generation graphics card, for now the specifications are not final but they do give us an idea of ​​where the shots will go.

Let no one get excited since we are not expected to see the first GPUs with HBM3 memory until at least 2019, AMD has been the pioneer in betting on this technology and its next top-of-the-range cards in 2018 will continue to use HBM2 memory whose potential is much higher than what we have been able to see in the Radeon RX Vega, so there is still a lot of room to exploit.

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RAMBUS claims that the HBM3 memory will double the bandwidth of the current HBM2, that at least. With this we can expect that HBM3 offers a bandwidth of 512 GB / s for each stack, just double the current HBM2 that remains at 256 GB / s maximum for each stack with a 1024-bit interface. The use of two HBM3 stacks would give us a figure of 1 TB / s of bandwidth while with four stacks 2 TB / s could be reached. To achieve these impressive features, a 7nm manufacturing process will be used.

GPU manufacturers should not be in a hurry to mount this new HBM3 memory, because we have seen how the rush has not brought anything good to an AMD that has seen how its Fiji and Vega architectures have not lived up to expectations for focus on an HBM memory technology with too little availability and that, when it comes down to it, has caused more problems than benefits.

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