3d qlc memories are a headache for manufacturers

3D QLC is the latest NAND memory-ready technology, with promises of a higher density than 3D TLC, making prices per GB even lower. However, as with all wafer-based PC components, performance is an extremely important part of that process. Cost reduction can only be achieved if manufacturing allows a certain percentage of a wafer to be fully functional and without defects that compromise its feature set or performance.

3D QLC memory technology promises higher capacity, lower cost SSDs

Currently 3D QLC memories are giving manufacturers headaches, with very low wafer performance, around 50% or less.

As reported by the DigiTimes site, 3D TLC performance has only taken off earlier this year, just as companies were launching their first 3D QLC designs. And yes, it took TLC longer than expected to achieve respectable wafer yields, and it looks like QLC will take even longer:

It was known that manufacturers such as Intel and Micron were having less than 50% performance with 3D QLC, but it seems that all manufacturers are encountering this problem, and we are not talking about few manufacturers (Samsung Electronics, SK Hynix, Toshiba / Western Digital and Micron Technology / Intel).

The result of this is going to be that prices are likely to tend to rise in early 2019, as the projected production volume is not meeting demand, and 3D TLC supplies are going to have to cope with higher demand because QLC memories will be scarce.

Informaticacero Source (Image) Techpowerup