The amd ryzen 3000 processors will come with the ihs soldered
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We continue to know more information about Ryzen 3000 processors after their presentation at Computex, and the news today is that AMD has decided, again, to solder the IHS directly to the Die of the processor, improving temperatures and favoring overclocking.
AMD re-solders its processors with Ryzen 3000 series
AMD has used soldering on all of its Ryzen CPUs, Ryzen Theadripper CPUs, and upcoming Ryzen 'Picasso' APUs have also been confirmed to include soldered IHS. Continuing the tradition, AMD will also introduce IHS soldering in its upcoming Ryzen 3000 series processors, which are based on the Zen 2 core.
AMD uses a very high quality solder design in its processors that includes gold plating and silicone protected capacitors that offer increased durability and proper contact.
Since soldered designs help improve heat dissipation, that extra headroom can be used for chip overclocking, which in the case of Ryzen 3000 is looking to be stellar given the reports we've seen so far.
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AMD uses three chips in each of its Ryzen 3000 CPUs, two Zen 2 arrays, and one I / O array. The Zen 2 CCX is configured with 4 cores and there are 2 CCX for each Zen 2 matrix. Therefore, the 8 core parts can be configured with a single Zen 2 die, while the 8+ cores will be configured with two Zen 2 dies. AMD is experienced in soldering a chip with multiple dies, as its Ryzen Threadripper series, which also makes use of soldering, has a total of 4 Zen / Zen + chiplets in the interposer.
As the IHS is soldered, this also makes the practice of delidding more difficult.
Amd Confirms Second Generation Ryzen Processors Will Come Soldiers
AMD will continue to use solder on second generation Ryzen processors, this will allow for much more efficient dissipation.
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