Msi meg x570 ace review in Spanish (full analysis)
Table of contents:
- MSI MEG X570 ACE technical characteristics
- Unboxing
- Design and Specifications
- VRM and power phases
- Socket, chipset and RAM memory
- Storage and PCI slots
- Network connectivity and sound card
- I / O ports and internal connections
- testing bench
- BIOS
- Overclocking and temperatures
- Final words and conclusion about MSI MEG X570 ACE
- MSI MEG X570 ACE
- COMPONENTS - 90%
- REFRIGERATION - 92%
- BIOS - 90%
- EXTRAS - 91%
- PRICE - 88%
- 90%
Buying a motherboard is not an easy task, especially when there are hundreds of models on the market. MSI wants to make it easy for us with the MSI MEG X570 ACE with military-class components, outstanding dissipation and assured performance for gaming and heavy tasks.
Is the MSI MEG X570 ACE the most compensated motherboard with X570 chipset? We will solve this question during the analysis and we will see all its benefits and drawbacks. Don't miss our review!
As always we have to thank MSI for the trust placed in us and send us this motherboard for analysis on the day of its launch.
MSI MEG X570 ACE technical characteristics
Unboxing
MSI MEG X570 ACE has come to us in a box with a presentation similar to the GODLIKE, that is, a first flexible cardboard box that has the entire surface printed in photos of the plate and information in schematic mode on the back and lateral.
If we remove this first box, we find the one that really houses the product, one built in black rigid cardboard with only the MSI logo and opening in case mode. Inside, two floors to separate the accessories from the motherboard, perfectly supported by a cardboard mold and an antistatic plastic bag.
The bundle has the following accessories (we already anticipate that they are less than the GODLIKE for obvious reasons):
- MSI MEG X570 ACE motherboard Wi-Fi antenna with extender cable Corsair Rainbow LED cable Double-head RGB LED splitter Extension Rainbow LED cable 4x flat SATA 6 Gbps cables DVD with drivers and software Stuff stickers and bag User card and quick installation
It is a much cheaper product, so elements such as expansion cards and a greater number of cables are removed, although the bundle is still extremely complete and with good quality cables
Design and Specifications
The second highest performance board that MSI makes available to the user is this MSI MEG X570 ACE, very similar in appearance to the GODLIKE version, although with notable differences in connectivity as we will see later, and less noticeably in the general design. In this case, the size also decreases to a standard ATX format 305mm high by 244 wide.
Starting with its exterior design we have a cooling system quite similar to that of the MSI MEG X570 GODLIKE, where MSI has done a great job in building a large number of XL size aluminum heatsinks. In this case, we have a chipset area with gray and gold details hiding the fan with ZERO FROZR technology that adapts its speed according to the needs of the chipset. Although we lose the RGB lighting in this area.
If we continue to the left, the three heatsinks with integrated thermal pads for the M.2 units are also maintained with details in gold. The system integrates a heatpipe that starts from the chipset itself and continues to pass through the two VRM heatsinks until it ends under the rear I / O panel. MSI Mystic Light Infinity illumination has been included on the top cover of the port panel providing EMI protection.
At the rear we do not have any protection backplate, and we only have the typical special paint that is responsible for insulating and protecting the electricity lines from wear and tear. In general, it is a somewhat more basic design than the top range, losing lighting elements and also the OLED notification screen, but it still has an effective cooling system for all the key elements.
VRM and power phases
MSI MEG X570 ACE also lowers the performance of its VRM a bit with a configuration of 12 + 2 + 1 power phases, where the main 12 phase line will be in charge of generating the voltage for the CPU or Vcore. The other two phases will take care of the RAM, while the third will manage other hardware aspects of the motherboard. To disassemble and get to the VRM we have to completely disassemble the heatsink and leave the motherboard bare.
Let's divide the energy system into three main stages and two previous ones to explain all its elements in an orderly way. In the first instance, it maintains a dual 8-pin EPS power connector each. Power from the PSU will pass through an IR35201 digital PWM control manufactured by Infineon. This control is designed for the voltage regulation of the following elements at a maximum switching frequency of 2000 kHz in a 6 + 2 multiphase configuration.
This controller will send the PWM signal and voltage to the three main stages. The first of these consists of 6 Infineon phase multipliers IR3599 that are responsible for duplicating the signal to generate the 12 phases of power that are counted. In the second stage, a total of 12 MOSFET DC-DC converters IR3555 manufactured by Infineon of the DR.MOS family with capacity to withstand up to 60A of current have been used. This stage is somewhat less powerful and basic than the top-of-the-range model. We finish with the 12 CHOKES built in titanium that stabilize the signal through high-quality capacitors.
Something that we have not lost in this model is the physical selection wheel MSI Game Boost, with which we can perform a controlled overclocking and automatically to get the maximum benefits from the new AMD Ryzen 3000. If we prefer, we will have similar functionality in the Dragon Center software from the operating system itself.
Socket, chipset and RAM memory
This new platform is designed to house the new 3rd generation AMD Ryzen processors with a 7nm manufacturing process. But AMD has already allowed backward compatibility with its previous processors thanks to maintaining the AM4 socket for the SoC. In this case, MSI certifies compatibility with 3rd and 2nd generation AMD Ryzen processors with, and without integrated Radeon Vega graphics. Nothing is said about 1st Generation Ryzen APUs neither in its specs nor in its compatibility list.
The AMD X570 chipset is one of the great novelties of this generation of boards, with no less than 20 PCI lanes available to the manufacturer to introduce the devices it deems appropriate, although always keeping 8 of these lanes fixed for PCIe 4.0 and for communication. with the CPU. The rest of the lanes will be able to house SATA, M.2 and USB ports up to 3.1 Gen2 if deemed appropriate.
Finally we talk about the 4 DIMM slots that support a total of 128 GB of DDR4 RAM at speeds of 1866, 2133, 2400 and 2666 MHz in Dual Channel according to manufacturer specifications. They support DDR4 BOOST and A-XMP profiles, so we should have no problem installing higher frequency memories on this board, such as the ones we have used in our 3600 MHz test bench with custom JEDEC profiles. In fact, Ryzen CPUs natively support effective frequencies of up to 3200 MHz from memories.
Storage and PCI slots
Regarding Storage and PCIe slots, we must differentiate those that are connected to the chipset and the CPU. The total count is 3 PCIe 4.0 x16 slots and two PCIe 4.0 x1 slots, although it will be important to know their speed and capacity settings based on the CPU generation that we install in the two main slots:
- With 3rd generation Ryzen CPUs the top two slots will work in 4.0 mode at x16 / x0 or x8 / x8. With 2nd generation Ryzen CPUs the top two slots will work in 3.0 to x16 / x0 or x8 / x8 mode. With 2nd generation Ryzen APUs and Radeon Vega graphics, the same slots will work in 3.0 to x8 / x0 mode. The second PCIe x16 slot will be disabled for APU.
The remaining three will be connected to the X570 chipset as follows:
- Slot x16 will work in 4.0 or 3.0 mode, although it only supports one x4 speed, both PCIe x1 slots will work in 4.0 or 3.0 mode
It is important to know that the two PCIe x1 slots will not be able to work simultaneously. If we install a card in one, the other will no longer be available. These are important things that a user should know before getting to install expansion cards and find unpleasant surprises.
Now we must talk about storage where the CPU will manage only one M.2 PCIe 4.0 x4 slot of this MSI MEG X570 ACE of the three it has. It supports sizes 2242, 2260, 2280 and 22110, entirely for drives under the PCIe bus and not for SATA. You can assume that, if we install a 2nd generation Ryzen, the bus will become 3.0.
The other two slots will be able to operate in PCIe 4.0 x4 and SATA III mode, with available sizes of 2242, 2260 and 2280. And they are connected directly to the chipset bus. The manufacturer does not indicate limitations in this regard if we want to simultaneously connect three M.2 units together with the 4 SATA III 6 Gbps ports that will also be managed through the chipset. In all of them, it is possible to make RAID 0, 1 and 10 configurations with up to 4 storage devices and Store MI technology.
Network connectivity and sound card
MSI MEG X570 ACE has a high-level sound card, thanks to a Realtek ALC1220 codec with capacity for 7.1 channels of high definition audio. The SABER ESS series amplifier DAC has been chosen to provide an impedance of up to 600 Ω in headphones thanks to MSI AUDIO BOOST and high quality Chemicon and WIMA capacitors. Of course, digital audio output is included through S / PDIF, although not the Jack der 6.3 connector that does have the GODLIKE board.
Network connectivity is also a stepping stone, although we still have a dual Ethernet interface for wired connectivity. The first port is controlled by a Realtek RTL8125 that provides a bandwidth of 2.5 Gbps, while the second port offers 10/100/1000 Mbps connectivity thanks to an Intel 211-AT GbE chip.
In the wireless section, a M.2 2230 CNVi Intel Wi-Fi 6 AX200 card has been chosen, which is, let's say, the normal version of the Killer range oriented to gaming. The bandwidth performance is exactly the same, 2, 404 Mbps in the 5 GHz band and 574 Mbps in the 2.4 GHz band. All this thanks to 2 × 2 connections with MU-MIMO technology and under a frequency of 160 MHz in the IEEE 802.11ax protocol. Obviously, having this bandwidth will only be possible with a router that works on the same protocol, otherwise it will work through 802.11ac reaching up to 1.73 Gbps.
I / O ports and internal connections
We reached the final stretch of the technical characteristics count, giving a good overview of the external and internal ports available on the MSI MEG X570 ACE. From the photos we have placed, you can see how we have on-board buttons for power, reset and automatic overclocking. Also an important Debug LED panel to display BIOS and hardware status messages.
A fundamental software for MSI products will be Dragon Center, since it will provide us with a very complete dash board on the characteristics of our motherboard. We will be able to monitor the heating of its 7 temperature sensors, customize the profile of up to 6 fans or water pumps using a PWM signal. Similarly, we can overclock in a simple way without accessing the BIOS.
After this, let's look at the rear ports panel:
- Clear CMOS button Flash button BIOS2x connectors for antennas PS / 22x ports RJ.45 Ethernet2x USB 2.02x USB 3.1 Gen13x USB 3.1 Gen21x USB 3.1 Gen2 Type-S / PDIF port5x 3.5mm jack for audio
It is striking to have two more USB ports on this rear panel than the GODLIKE board, although now you will see what the reason is.
We go to see the internal ports:
- 1x USB 3.1 Gen2 Type-C2x USB 3.1 Gen1 (supporting 4 USB ports) 2x USB 2.0 (supporting 4 USB ports) Connector for front audio panel 8x connectors for fans and cooling pump TPM2x connector 2-pin headers for temperature sensors (available in the bundle) 1x 4-pin RGB LED header2x 3-pin headers A-RGB LED1x 3-pin header for Corsair RGB LED
Let's see which USB ports go to chipset and CPU:
- X570 chipset: 2 USB 3.1 Gen2 rear panel, USB 3.1 Gen2 Type-C internal, 4 USB 3.1 Gen1 internal, 4 USB 2.0 internal and 2 USB 2.0 rear panel. CPU: 2 USB 3.1 Gen2 and 2 USB 3.1 Gen1 rear panel
The reason for having inserted two extra USB 2.0 ports, is because in this case we only have 4 SATA ports connected to the chipset, so there was more space available to expand peripheral connectivity.
testing bench
TESTING BENCH |
|
Processor: |
AMD Ryzen 9 3900x |
Base plate: |
MSI MEG X570 ACE |
Memory: |
16GB G.Skill Trident Z RGB Royal DDR4 3600MHz |
Heatsink |
Stock |
HDD |
Corsair MP500 + NVME PCI Express 4.0 |
Graphic card |
Nvidia RTX 2060 Founders Edition |
Power supply |
Corsair AX860i. |
This time we will also use our second test bench, although of course with AMD Ryzen 9 3900X CPU, 3600 MHz memories and a dual NVME SSD. Being one of them PCI Express 4.0.
BIOS
We continue with the AMIBIOS of MSI. The positive part is that they are very well purified and allows us to do everything: monitor, adjust voltages, a good level of overclocking (although in this range of Ryzen 3000 processors it is very green) and control any option on our board. The bad is that you need a facelift and have a more current design. For the rest, we are very happy.
Overclocking and temperatures
At no time have we been able to upload the processor at a faster speed than what it offers in stock, it is something that we have already discussed in the review of the processors. Although we want to give proof, nevertheless we have decided to do a 12 hour test with Prime95 to test the feeding phases.
For this we have used our Flir One PRO thermal camera to measure the VRM, we have also collected multiple measurements of average temperature with the stock CPU both with and without stress. We leave you the table:
Temperature | Relaxed Stock | Full Stock |
MSI MEG X570 ACE | 43 ºC | 49 ºC |
Final words and conclusion about MSI MEG X570 ACE
The MSI MEG X570 ACE is one of the most interesting motherboards that MSI has released on the day of AMD Ryzen 3000 launch. We already saw it during Computex 2019 and we really liked what we saw, now we can confirm that it is a 100% motherboard recommended.
It has a total of 12 + 2 + 1 power phases, a remarkable cooling system in both VRM and NVME storage and a much improved sound compared to other generations.
We recommend reading the best motherboards on the market
At the connectivity level we have two network cards, one of them is Gigabit and the other 2.5 GBIT. It is accompanied by an 802.11 AX (Wifi 6) wireless interface, ideal to take advantage of the most powerful routers on the market.
As we have seen in the analyzes of the Ryzen 7 3700X and Ryzen 9 3900X we can get the most out of it by playing. It is no longer necessary to purchase an Intel processor to enjoy high-end games that are more demanding.
Before their analysis we do not know the price that these new MSI motherboards will cost. We have noticed a notable increase in quality in your AM4 motherboards, we are sure that they will have a slightly higher price than the previous generation. What do you think about the MSI MEG X570 ACE?
ADVANTAGE |
DISADVANTAGES |
+ DESIGN |
|
+ VERY QUALITY VRM | |
+ PERFORMANCE |
|
+ WIFI 6 AND 2.5 GBIT LAN CONNECTION |
|
+ REFRIGERATION |
The Professional Review team awards him the platinum medal:
MSI MEG X570 ACE
COMPONENTS - 90%
REFRIGERATION - 92%
BIOS - 90%
EXTRAS - 91%
PRICE - 88%
90%
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