Intel will offer wlan and usb 3.1 drivers

It is time to talk about the future of Intel to refer to its new range of WLAN and USB 3.1 controllers. We are facing the 7th generation Core “Kaby Lake” , with the new 200 series very close to being launched on the market, exactly for CES in January 2017, one of the most important and recognized events worldwide. In the case of the 300 series, we would still have to wait until the end of next year 2017.

Intel Cannonlake will incorporate WLAN and USB 3.1 natively

In this 200 chipset series with Intel Kaby Lake processors, we expect a lot of features but really nothing that surprises us too much. There is talk of performance improvement, which should be the bare minimum when jumping from one generation to the next. But to be honest, we don't expect anything extraordinary either. Currently, 100 series motherboards are receiving BIOS updates from manufacturers. The objective? Make them compatible with your new processors.

But we wouldn't just jump into the 200 series with the Kaby Lake processors, because the guys from Intel intend to go further, towards the 300 series, with the Intel Cannonlake processors. This 300 series, would arrive at the end of 2017. The data we have at the moment, refers to wireless network functions. We expect some variant with native WLAN controllers, with 802.11 a / b / g / n support (it seems that an AC will be more complicated) and a native USB 3.1 controller.

We recommend reading our guide to processors.

To give you an idea of ​​the potential of these new controllers, many manufacturers today include chips to handle USB 3.1 or Wi-Fi. But the most notable and important improvement is that they will be integrated into the Intel 300 series. It is possibly the highlight of this great evolution, which would leave at the end of next year 2017.

More at CES 2017

We will keep you informed of all the news that we are learning about chipsets. The next appointment we have with CES 2017, we will tell you everything in scoop so that you discover all the news of the chipsets 200 and 300. What do you think about the possible incorporation of these two new technologies in the series motherboards?