Ryzen 4000 and x670 chipsets would arrive in late 2020
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Ryzen 4000, the fourth generation of Zen 3-based AMD processors, would arrive in late 2020, according to the latest information.
Ryzen 4000 and X670 chipsets would arrive in late 2020 for the AM4 platform
The report from ' mydrivers ' talks about two next-generation AMD products, the AMD Ryzen 4000 line of processors for desktops and the 600 series chipset-based platform. The Ryzen 4000 range of CPUs will feature the central Zen architecture 3 of 7nm + improved. 7nm + EUV technology will increase the efficiency of Zen 3 based processors while increasing overall transistor density, however, the biggest change in Ryzen 4000 series processors would come from the Zen 3 architecture, which is expected to Bring a new die design, which will allow for significant gains in IPC, faster clock speeds, and a higher number of cores.
In addition to the Ryzen 4000 processors for desktops, AMD will also introduce its 600 series chipset. The flagship of this new series would be AMD X670 that will replace the X570. According to the source, AMD's X670 would retain the AM4 socket and boast improved PCIe Gen 4.0 support and increased I / O in the form of more M.2, SATA, and USB 3.2 ports. The source adds that there is little chance of getting Thunderbolt 3 natively on the chipset, but overall the X670 should improve the X570 platform overall.
This is very good news, as it ensures that AM4 motherboards will be able to handle one more generation of Ryzen processors before making the leap to new motherboards, presumably AM5. On the other hand, this is what AMD had promised from the beginning, so the promise they made in 2017 of a support for AM4 until 2020 would be kept.
Starting in 2021, AMD will likely need to use a new motherboard architecture to add support for DDR5 memory and the PCIe 5.0 interface.
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Based on the 7nm + process node, AMD aims to offer some major IPC improvements and key architectural changes with the Zen 3 core. Just as Zen 2 doubled the number of cores in Zen 1, offering up to 64 cores and 128 threads, Zen 3 would also drive higher numbers of cores with improved nodes.
Finally, TSMC's new 7nm + process node, which is manufactured using EUV technology, is estimated to offer 10% more efficiency than its 7nm process, while offering 20% more transistor density.
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