Samsung creates the first 3d chip technology
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As one of the leading technology companies, Samsung is always working on new ideas. This is why it has recently introduced the world's first 12-layer 3D-TSV chip packaging technology. You may not understand what this means exactly, but it will certainly improve the efficiency and power of future memory units.
Samsung's new technologies will improve some of the future components
3D-TSV chip packaging technology is considered a rather complicated one for mass development. After all, this technology is used in high-performance chips and requires exact precision to vertically connect 12 DRAM chips in a three-dimensional configuration of more than 60, 000 TSV holes . Since each hole measures less than twenty of a human hair, any tiny error can be fatal to the manufacturing unit.
Despite having a greater number of layers, the new packages have a volume similar to that of the current units, which only have 8.
This will allow to increase the capacity and power without having to develop strange design and / or configuration solutions by the brands.
In addition, 3D packaging technology will bring lower data transmission times between chips. This will directly increase the power of future components, as well as their energy efficiency, something the industry is focusing on a lot.
The packaging technology that secures all the complexities of ultra-powerful memories is becoming tremendously important with the myriad of new-age applications such as Artificial Intelligence (AI) and High Power Computing (HPC). ”
- Hong Joo-Baek, Executive Vice President of TSP (Test & System Package)
Moore's Law seemed to be in its last stages, but with advances like these, things seem not yet finished. Not surprisingly, there is still time until we see the first memories with this technology, so stay tuned for news.
And you, what do you expect from the technologies that Samsung develops? Do you think Moore's Law will continue to be fulfilled 10 years from now? Share your ideas in the comment box.
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