Tsmc takes its first successful steps using euv
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TSMC, the world leader in semiconductor manufacturing and at the forefront of 7 nanometer production, has just announced that it is making progress with its second generation of 7nm "N7 +" technology, using EUV (extreme ultraviolet lithography).
TSMC already works successfully with EUV technology and aims at 5nm for 2019
TSMC has already successfully engraved a first N7 + design from an unidentified client. Although not fully EUV yet, the N7 + process will see limited use of EUV for up to four non-critical layers, giving the company an opportunity to discover how to make the best use of this new technology, how to increase production in dough, and how to fix the little problems that appear as soon as you move from the lab to the factory.
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The new technology is expected to generate between 6 and 12% less consumption, and a 20% better density, which could be especially important for more limited devices such as smartphones. Moving beyond 7 nanometers, the TSMC target is 5nm, internally called "N5". This process will use EUV in up to 14 layers and is expected to be ready for mass production in April 2019.
According to TSMC, many of its IP blocks are N5 ready, with the exception of PCIe Gen 4 and USB 3.1. Compared to N7 designs, which have initial costs in the 150 million range, the cost for N5 is expected to increase further, to 250 million.
These data demonstrate that progress in manufacturing processes is increasingly difficult and expensive, without going any further, GlobalFoundries recently announced that it is paralyzing its process at 7 nm indefinitely.
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