Hbm 3d stacked memory will arrive with amd pirate islands

The new HBM memory has been created by Hynix and AMD together to be the replacement of the current and stagnant GDDR5 that already has several years behind it. The new memory has been designed with the aim of providing high bandwidth to the GPUs of the future while reducing their power consumption compared to the GDDR5.

In the first generation of the new memory, Hynix will place 4 pieces of DRAM memory in a simple layer that will be interconnected with each other with vertical channels called TSV (through-silicone via). Each of them will be able to transmit 1 Gbps, which theoretically offers a bandwidth of 128 GB / s thanks to 4 rows per stack.

The second generation will have 256 MB pieces forming 1 GB stacks which in turn would form 4 GB modules. giving a bandwidth of 256 GB / s. They also believe that they will be able to reach 8 layers, which would allow for an increase in capacity but not bandwidth.

This type of memory will make its debut with the new AMD Radeon R9 300 series graphics cards based in Pirate Islands and manufactured in 20nm. AMD has worked together with Hynix to develop the HBM memory and will be able to use it exclusively during the 2015 mining years that Nvidia will have to wait until 2016 and its Pascal architecture to be able to use it, so its products launched in 2015 will continue to use GDDR5. AMD is also expected to use HBM memory in its future APUs.

AMD and Hynix intend to continue developing this technology for years to come, seeking to increase its capacity, performance, and energy efficiency.

Source: wccftech and videocardz