Motherboards with the intel b365 chipset will debut on January 16
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In September last year, Intel released the H310C chipset, which reduced the manufacturing process for the H310 chip from 22nm to 14nm. Soon after, Intel announced that it would release a "new" B365 chipset, which is an improved version of the B360.
Intel B365 motherboards, manufactured in 22nm, will debut on January 16
According to the latest information that has emerged from Asian sources, the first motherboards based on the B365 chipset would debut on January 16, supporting the 8th and 9th generation of Intel Core processors. The funny thing here is that the new chipset will be made in 22nm and not in 14nm like the B360, once again showing the problems Intel is having in its 14nm production chain, fully saturated by delays in 10nm.
Intel B365 vs B360
In a comparative table, we can see the Intel B365 chipset versus the B360, where the new B365 chipset seems to have some similarities with respect to the 'old' H270 chipset, with its 16 PCIe 3.0 lines, 8 USB 3.0 ports, support for up to 6 ports SATA and same RAID configuration.
The difference with the B360 chipset can be seen in the maximum number of PCIe lines, which goes up to 20 in the B365, the maximum 14 USB ports and the possibility of configuring a RAID. What if it would lose is the WiFi connectivity, it seems that Intel has decided to do without the Wireless-AC MAC on this chip, unfortunately.
It is expected that motherboards with B365 (LGA 1151) chipsets will slowly replace those with the B360 on the market. We will keep you informed.
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