Intel b365 express chipset released at 22nm released

Much has been reported about Intel and its efforts to alleviate its overloaded 14nm production lines to increase its production capacity. There have also been reports that Intel plans to re-manufacture 22nm chips, and this has already been confirmed with the new Intel B365 Express chipset.

Intel B365 Express, new current chipset manufactured at 22nm

Intel B365 Express is a new motherboard chipset that has been released as an intermediate to its B360 Express and H370 Express chipsets. This model is characterized by being manufactured with the 22 nm HKMG + silicon manufacturing node, to release manufacturing capacity at 14 nm ++ for the company's processors. Despite this, the TDP of the chipset remains unchanged at 6 watts. The Intel B365 Express has a couple of additions and subtractions over the Intel B360. First, it has a larger PCI-Express complex, with 20 3.0 lanes that put it on par with the H370 Express. The B360 only has 12 PCIe lanes. This means that the B365 motherboards will have additional M.2 and U.2 connectivity.

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According to the ARK spec page, this Intel B365 Express chipset completely lacks built-in 10 Gbps USB 3.1 gen 2 connectivity. The chipset also loses the latest generation of integrated Wireless AC. All of this points to the possibility that the B365 Express is a redesigned Z170 with blocked CPU overclocking. Adding credibility to this theory is the fact that while the B360 uses ME version 12, the B365 uses the older ME version 11. Like the H310C, the B365 could include platform support for Windows 7.

It shouldn't take long to see the first motherboards with the Intel B365 Express.