Lpddr5, micron presents the first umcp chip with this memory
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The chip with LPDDR5 memory and 3D NAND UFS flash designed and manufactured by Micron will be used in mid-range mobile devices that will debut on the market in 2021.
Micron Introduces First uMCP Chip with LPDDR5 Memory
Micron announced that it has developed the world's first uMCP chip that integrates UFS storage and LPDDR5 memory that improves performance and overall consumption.
Due to space limitations on smartphone motherboards, non-volatile storage and RAM are located as close to the SoC as possible and are stacked when possible. This solution has the advantage of minimizing the distances between the components and allowing the most direct interconnection possible.
What's new is that Micron engineers were able to design and build a multi-chip module (MCP) that integrates LPDDR5 and UFS - a uMCP. This will be installed in mid-range mobile devices with 5G connectivity support, which will dominate the market in 2021, as stated by all analysts and manufacturers in the sector.
Micron's uMCP chip combines LPDDR5-6400 memory with up to 96-layer 3D NAND flash of TLC type (256GB maximum capacity). Storage is managed by a UFS controller.
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Both LPDDR5 and UFS memory are produced using a 10nm lithographic process. The package is of the BGA (Ball grid array) type with direct soldering on the motherboard.
This solution saves 40% of motherboard space by combining RAM, storage, and controller on a single chip, but also improves bandwidth by 50% compared to the previous generation of uMCP. Therefore, they are all advantages to continue making thin and light weight phones and still improve their performance and benefits.
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