Mediatek helio x30 announced at 10nm finfet

The MediaTek Helio X20 has proven to be a great mobile processor, but once again the Chinese firm has lagged one step behind the two market leaders, Qualcomm and Samsung. The new MediaTek Helio X30 has been announced to try to storm the highest range with impressive specifications and an advanced manufacturing process at 10nm FinFET.

MediaTek Helio X30: features of the new Chinese top-of-the-range processor

The MediaTek Helio X30 is the new top-of-the-range processor from the Chinese manufacturer and is manufactured with TSMC's advanced 10nm FinFET process to offer a huge leap forward in performance and energy efficiency over its predecessor. The MediaTek Helio X30 is based on a 10-core configuration that is divided into four Cortex-A73 cores at 2.80 GHz + four Cortex-A53 cores at 2.20 GHz + two Cortex-A35 cores at 2.00 GHz, a complex configuration that will allow you to manage better than anyone the energy depending on the power needs of each situation.

Every good processor needs great graphics, the new MediaTek Helio X30 leaves Mali designs aside to bet on a much more modern PowerVR GT7400 and capable of yielding 166.4 GFLOPs, a very respectable figure more if we consider that we are talking about a mobile chip with the limitations of energy and heat dissipation that this entails. With all this, the new MediaTek chip promises to be up to 30% more powerful than the Snapdragon 820.

Its specifications continue with the support for very high resolution screens to better adapt to virtual reality, cameras up to 40 megapixels, memory controller with support for 8 GB of 1600MHz LPDDR4 POP RAM and 4G LTE Cat.12 modem (up to 600 Mbps).

The first smartphones with the MediaTek Helio X30 will arrive at the end of the year.