Sk hynix introduces its 72-layer 3d nand memory chips
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SK Hynix today introduced the first 3D NAND memory chip on the market consisting of no less than 72 layers, these chips are based on TLC technology and offer a storage density of 256 Gibagit, 1.5 times more than previous 48-layer 3D chips.
SK Hynix takes another step forward in 3D NAND memory
This announcement reaffirms SK Hynix's leadership in manufacturing 3D NAND memory, the manufacturer already launched its 32-layer chips in April 2016, followed up with 48-capable chips in November of the same year, and has finally made the leap to the 72 layers. This can improve productivity by 1.5 times in mass production and improve the speed of memory read and write operations by 20% for a new generation of even faster SSDs.
The price of SSDs will rise 38% until 2018
In addition to increased speed, this new 72-layer 3D NAND memory from SK Hynix offers 30% more energy efficiency than its 48-layer predecessors, an important step in reducing the power consumption of new generation SSDs.. The manufacturer expects the demand for 3D NAND memory to increase greatly in the near future due to the great boom in the field of artificial intelligence, in addition to large data centers and cloud storage.
Source: techpowerup
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