Toshiba memory corporation announces its 96-layer nand bics qlc chips

Toshiba Memory Corporation, the world leader in manufacturing memory solutions based on flash technology, has announced the development of a prototype sample of a 96-layer BiCS QLC NAND chip, its proprietary 3D flash memory technology, with 4-bit QLC technology by cell, which allows to significantly increase the capacity of a single chip to the highest level reached so far.

Toshiba's 96-layer BiCS QLC NAND memories enable 1.33 terabit capacity with a single chip

Toshiba Memory Corporation has confirmed that it will begin delivering the first ours of this 96-layer NAND BiCS QLC memory technology to SSD manufacturers in early September, with the intention of launching mass production next year 2019. This new 96-layer NAND BiCS QLC chip enables a capacity of 1.33 terabits with a single chip developed jointly with Western Digital Corporation. Using 16 of these chips in a single package it will be possible to build SSD drives with a capacity of 2.66 TB, a real achievement in the sector.

In this way Toshiba Memory Corporation is prepared to lead the portfolio of products focused on dealing with the enormous volumes of data generated by mobile terminals and the expansion of SNS and progress in IoT. All this data must be used in real time, so SSD storage becomes essential due to its great speed advantage over mechanical hard drives. Toshiba Memory Corporation will showcase packaging based on these 96-layer NAND BiCS QLC chips at the 2018 Flash Memory Summit in Santa Clara, California, from August 6 to 9.

Toshiba Memory continues to improve memory capacity and performance, and develop new technologies to meet the diverse needs of the market, including the rapidly expanding data center storage market.

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