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Toshiba unveils 64-layer 3d flash memory ufs devices

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Toshiba's new UFS devices are based on advanced 64-layer BiCS FLASH 3D flash memory and will be available in four capacities: 32GB, 64GB, 128GB and 256GB.

Uses BiCS FLASH 64-layer 3D flash memory

Toshiba Memory America, the world leader in memory solutions, has started testing UFS universal flash storage devices using its advanced 64-layer BiCS FLASH 3D flash memory.

All four devices are compatible with JEDEC UFS Ver. 2.1, including HS-GEAR3, which has a theoretical interface speed of up to 5.8 Gbps per track (x2 tracks = 11.6 Gbps) without impacting on power consumption. The sequential read and write performance of the 64GB device is 900MB / second and 180MB / second respectively.

When it comes to random read and write performance, it's about 200 and 185 percent better than the manufacturer's previous-generation devices. Due to its serial interface, UFS supports full duplex printing, allowing both simultaneous reading and writing between the host processor and the UFS device.

Toshiba was the first company in the world to announce 3D flash memory technology, and the addition of 3D-based UFS keeps the company at the forefront of innovation, while enhancing its existing range of BiCS FLASH solutions.

"By bringing our industry-leading BiCS FLASH technology to UFS, we continue to expand the capabilities of our integrated storage solutions, " said Scott Beekman, director of TMA-managed flash memory products.

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