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Tsinghua unigroup will manufacture 3d nand memory for intel

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It is no secret that the demand for NAND memory exceeds current supply, which has led to an increase in SSD prices in the past two years. To try to alleviate this situation, Intel is seeking an agreement with the Chinese manufacturer Tsinghua Unigroup.

Tsinghua Unigroup to manufacture Intel 64-layer NAND memory

Intel and Tsinghua Unigroup are already in talks to license the semiconductor giant's 64-layer 3D NAND memory technology. Tsinghua Unigroup has been the biggest beneficiary of the Chinese government's decision to invest more than a trillion RMB over the next five years to increase the country's memory production capacity until 2025.

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This movement will increase the supply of NAND memory significantly, currently the largest manufacturers are Samsung, SK Hynix and Toshiba, which do not have the capacity to produce enough memory chips, or are not interested in doing so to maintain high prices in the market..

Leading manufacturers of NAND 3D memory are already working on 96-layer chips that will offer a higher storage density than current 64-layer ones, this should also help alleviate the scarcity situation. Hopefully, thanks to this, the prices of SSDs will begin to drop significantly throughout this year 2018.

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