Tsmc presents its 6 nm node, offers 18% more density than 7 nm
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TSMC announced its 6nm (N6) process, an improved variant of its current 7nm node, and offers customers a competitive performance advantage as well as a quick migration from those 7nm (N7) designs.
TSMC promises easy migration to 6nm
Taking advantage of new capabilities in extreme ultraviolet lithography (EUV) gained from the N7 + technology currently in production, TSMC's N6 (6nm) process offers an improved density of 18% over N7 (7nm). At the same time, its design rules are fully compatible with TSMC's proven N7 technology, making it easy to reuse and migrate to this node, resulting in less headache and benefits for companies that are betting on the 7 today. nm (AMD, for example).
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Scheduled for risky production in the first quarter of 2020, TSMC's N6 technology provides customers with cost-effective additional benefits while expanding the industry-leading power and performance of the 7nm family for a wide range of products, such as mid-range and high-end mobiles, consumer products, AI, networks, 5G infrastructure, GPUs and high-performance computing.
Guru3D FontTsmc already has its 5 nm node ready and offers 15% more performance
We have information that TSMC has started risk production for the 5nm and has validated the process design with its OIP partners.
The 5nm tsmc offer 80% higher density than the 7nm
These new TSMC 5nm nodes would be used en masse from 2020 and promise 80% higher density than what 7nm offers.
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