Tsmc already has its 5 nm node ready and offers 15% more performance
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Unlike Intel, chipmakers around the world are rapidly moving to next-generation lithography and processes, such as 7nm. In the midst of this scenario, we have information that TSMC has started the production of 'risk' for the 5nm and has validated the design of the process with its OIP (Open Innovation Platform) partners.
The 5 nm TSMC have been validated, they will be used for 5G and IoT applications
TSMC's 5nm process offers a density of 1.8X and a performance gain of 15% compared to 7nm
TSMC announced the design and infrastructure of the 5nm node and as a result, we got to know more details of the process. TSMC, in collaboration with its partners, has validated its 5nm design through silicon test samples.
TSMC's 5nm is primarily aimed at 5G and IoT applications rather than processors, for now. The company has confirmed that the design kits are now available for the production process.
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The 5nm process enables a logical density of 1.8X and a 15% performance increase in a Cortex A72 core compared to 7nm. The company's first 7nm generation (present in the Apple A12 and Qualcomm Snapdragon 855) uses a DUV lithograph, while its 7nm + node based on the N7 + process uses EUV lithography.
TSMC seems to have everything on track, and after the 7nm process is well used, the next jump will be towards 5nm, perhaps in the next 3-4 years.
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