Tsmc joins forces with artificial intelligence leaders to manufacture its processors

Chinese AI leaders such as HiSilicon, Cambricon Technologies, Horizon Robotics, and DeePhi Tech have signed a collaboration agreement with silicon chip maker TSMC to give a major boost to their new solutions.

TSMC takes special importance in artificial intelligence

HiSilicon unveiled the Kirin 970 as the new flagship of integrated AI computing capabilities and was adopted into Huawei's Mate 10 and M10 Pro smartphone models released in mid-October 2017. Official production of these chips began in mid 2017 with TSMC's 10nm FinFET process at a monthly capacity of 4, 000 pieces of 12-inch wafers. Huawei is working to improve artificial intelligence capabilities in smartphones and wants to capture 40 percent of the Chinese smartphone market.

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Cambricon Technologies released three new processors with AI capabilities in November 2017: the Cambricon-1H8 for lower-power computer vision applications, the high -end Cambricon-1H16 for more general applications, and the Cambricon-1M autonomous driving applications. The company recently introduced MLU100 AI chips to support inference applications for small to medium-sized servers and data centers, and MLU200 chips to support training applications in R&D centers of AI companies. All of them will be manufactured using TSMC's 16nm process.

Horizon Robotics officially launched two artificial intelligence processors in December, one for image processing and the other for low-power smart city applications. The company plans to introduce a Bernoulli-based processor in 2018 and a Bayes-based processor in 2019.

DeePhi Tech plans to launch two system chipsets in 2018, one for AI cloud services and the other for AI terminal device applications, with the latter to adopt the company's in-house developed Aristotle architecture and manufactured using the 28nm process. of TSMC.

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