Tsmc and broadcom launch 5nm cowos for the next generation

The future is closer than we think and the 7nm may be an anecdote. Therefore, TSMC and Broadcom team up to launch CoWos.

It seemed crazy when a little over 1 year ago the 7nm reached our homes. However, TSMC and Broadcom have teamed up to launch CoWos, a next-generation platform that will bring 2.7TB / s bandwidth, less consumption and a smaller form factor. We tell you the details below.

TSMC and Broadcom together for CoWos

CoWos ( Chip on Wafer on Substrate ) is a technology that places logical chips and DRAM in a silicon interleaver. It is a 2.5D / 3D process that can reduce the size of the processor and achieve a higher I / O bandwidth. However, its manufacturing cost is much higher than normal chips, so it does not seem to be intended for desktop PCs.

Today, March 3, TSMC has announced the launch of its CoWos upgrade along with Boradcom to support the first interposer with dimensions that double the industry's grid size: 1, 700mm².

This platform is capable of hosting multiple logical systems on chips, offering up to 96 GB of HBM memory and a bandwidth of up to 2.7 TB / s. This is almost triple what the previous CoWos generation offered. If we make a comparison with the memory of the PC, it supposes an increase between 50 and 100 times.

So, this technology will be aimed at high-performance computing systems (supercomputers). TSMC said it is now ready to support 5nm process technology. As for Broadcom, Greg Dix, the Broadcom VP of the ASIC Products Division, spoke:

I am pleased to work with TSMC to advance the CoWos platform and solve many design challenges in 7nm and more advanced processes.

We recommend the best processors on the market

Do you think 2020 will be the year of the 5nm? Will we see this advance on our desktop PCs soon?

Mydrivers font