Sk hynix announces its 460 gb / s bandwidth hbm2e memories
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SK Hynix today announced that it has developed the highest bandwidth HBM2E DRAM in the industry. The new HBM2E features approximately 50% greater bandwidth and 100% additional capacity compared to the previous HBM2E.
Hynix announces production of HBME2 memories for 2020
The SK Hynix HBM2E supports over 460 GB (Gigabytes) per second of bandwidth based on the speed of 3.6 Gbps (gigabits per second) per pin with 1, 024 data I / O (Inputs / Outputs). Using TSV (Through Silicon Via) technology, a maximum of eight 16-gigabit chips are vertically stacked, forming a single, dense package of 16 GB of data capacity.
The SK Hynix HBM2E is an optimal memory solution for the fourth industrial era, supporting high-end GPUs, supercomputers, machine learning, and artificial intelligence systems that require the highest level of memory performance. Unlike DRAM products, which take the form of module packages and are mounted on system boards, the HBM chip is closely interconnected with processors such as GPUs and logic chips, spaced only a few µm units apart, allowing for even faster data transfer.
Visit our guide on the best RAM memory on the market
Will it be implemented in future graphics cards? Only time will tell. We will keep you informed.
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